Product Name: Gold Bonding Wire

Brand: HERAEUS

Detail

Superior Performance for Your Toughest Applications FP2 (99% pure) gold ball bonding wire exhibits very high tensile strength,
making it a wise choice for use in high density, CSP,QFP and advanced BGA packages                                                                                             
Stud Bumping Gold Wire                                                                                            Gold stud bumping wire provides versatility for all types of bumping applications including standard stud, coined, and stacked bumps. Available in  either 2N or 4N
Compositions