MICRO POINT PRO
Die Attach Tools
The Die Bonding process takes place prior to wire bonding. The selected die is placed in a package a
SJB Capillary
Solder Jet Bonding (SJB) is now the standard technology to support HDD requirements
Beside the comm
Fine Wire Wedge Bonding Tools
MPP Fine Wire Wedges range from fine pitch wedges to Ultra Fine Pitch Wedges (35 um pitch with a 20
Ribbon Wire Wedge Bonding Tools
The Fine Wire wedge models designed to fit applications using ribbon wires, feature a rectangular ho
Heavy Wire Wedge Bonding Tools
Large wire is usually considered to range from about 75 or 100 um to over 500 um in diameter (3-20 m