Semiconductor
Semiconductor‘s Product Types
Gold Bonding Wire
Superior Performance for Your Toughest Applications FP2 (99% pure) gold ball bonding wire exhibits v
Die Attach Tools
The Die Bonding process takes place prior to wire bonding. The selected die is placed in a package a
SJB Capillary
Solder Jet Bonding (SJB) is now the standard technology to support HDD requirements
Beside the comm
Heavy Wire Wedge Bonding Tools
Large wire is usually considered to range from about 75 or 100 um to over 500 um in diameter (3-20 m
Clean Dice
1. Reducing bond pad corrosion phenomenon; increase the removal of silicon
particles.
2. Effectively
Laser Sawing Solution
Laser Sawing Solution is design specifically for the laser cutting process.
Perfectly suitable for l
Electric Flame Off (EFO) / Torch Electrode
We can provide a full range of electronic flame off components (EFO's) incorporating Iridium or Plat